Application
FiberForm is used extensively in architectural building applications, in wall panels and on low temperature heating and ventilating equipment.
Operating Temperature
FiberForm is suitable for use at continuous operating temperatures up to 120¡æ and can be used at temperatures down to -50¡æ providing a 100% vapour barrier is maintained to prevent the ingress of moisture vapour.
Fire Performance
Unfaced, FiberForm complies with the Class ¡®O¡¯ requirements of the Building Regulations, when tested to BS476: Part 6: 1981 and Part 7: 1987.
FiberForm also complies with various European and American standards. Further details available on request.
Thermal Conductivity
0.037 W/mK @ 10¡æ